With the late July launch of AMD’s latest Congo platform delayed due to weaker than expected demand, AMD looks to launch the product in Q4 of 2009. Congo, “AMD’s next generation ultra-thin notebook platform”, will make use of a dual-core Turion Neo X2 L625, dual-core Athlon Neo X2 L335/L325 or single-core Athlon Neo MV-40 processors, and M780G chipsets. Built on the 65nm manufacturing process which has seen use in protable solutions for many years now, some industry experts are skeptical of the success of Congo. However, as has been noted on enthusiast technology forums, “People don’t buy nanometers… they buy features like good battery life and they look for good performance/dollar [ratio].” Once released, performance figures will determine who is right, but as yet nothing is certain.
Hewlett-Packard (HP) have already launched a 12.1-inch ultra-thin notebook (DV2-1113AX) in Taiwan at a price of NT$25,000 (around R5700) that features an Athlon Neo MV-40 CPU. This is combined with the RS690E chipset from the older Yukon platform. In addition to this, they have announced another ultra-thin model, priced at NT$32,000(around R7300). This model will feature a Turion Neo X2 L625 CPU.
With plans for two more ultra-thin notebook platforms – Nile and Brazos – over the next two years, as well as AMD’s traditional notebook platform Tigris (featuring a 45nm processor from an unconfirmed processor series), these are exciting times for the AMD notebook industry, one that certainly needs it.