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Thread: [Press Release] ASUS ROG Creates and Launches Patent-Pending Fusion Thermo Design

  1. #1

    Default [Press Release] ASUS ROG Creates and Launches Patent-Pending Fusion Thermo Design

    Taipei, Taiwan (July 23, 2012) ― making its first appearance on the ASUS ROG Maximus V Formula gaming and overclocking motherboard, Fusion Thermo™ combines enhanced passive air heat dissipation with liquid cooling readiness. It represents another ROG exclusive, and the first such design on any commercially-available motherboard. ASUS has applied for a Fusion Thermo™ patent, and the feature has garnered official endorsement from ten of the most renowned makers of liquid cooling hardware, including Swiftech® and EKWB. Fusion Thermo™ offers customers the utmost thermal flexibility and efficiency for intense gaming, overclocking, and case modding.

    For the full Press Release, please see this link











  2. #2

    Default Re: [Press Release] ASUS ROG Creates and Launches Patent-Pending Fusion Thermo Design

    This is so damn cool on so many levels... Pair this with a set of Kingston Hyper-X H2O and a waterblock on your GPU and you can daisychain everything over an insane radiator, maybe with a forced cooling set of sorts (say, 2 or 3 peltier modules on the hot side of the radiator), you'll get away with one AWESOME looking setup... :D

  3. #3

    Default Re: [Press Release] ASUS ROG Creates and Launches Patent-Pending Fusion Thermo Design

    Damn.. that is one very pretty board.

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